Cu
CU1332
Kupfer Platte
- Dicke:
- 0.9 mm
- Reinheit:
- 99.98+%
- Beschreibung:
- Temper half hard OFHC C103.
Technische Daten:
Maximum size 1m x 1m Typical analysis ppm: P<3, S<15, Zn<1, Cd<1, O<5, Hg<1, Bi<10, Pb<10, Se<10, Te<10,(Bi+Sn+Mn+Sb+As+Se+Te... Maximum size 1m x 1m Typical analysis ppm: P<3, S<15, Zn<1, Cd<1, O<5, Hg<1, Bi<10, Pb<10, Se<10, Te<10,(Bi+Sn+Mn+Sb+As+Se+Te total 40 max), O<20. Balance Cu 99.98+%.
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Citations
Formation mechanism and mechanical properties of compliant interconnects incorporating Cu nanowire arrays for heterogeneous integration
The conventional solder interconnects in heterogeneous integration face serious reliability issues resulting from thermally induced fatigue and premature brittle fracture. This study presents Cu nanowired compliant interconnects to solve these issues. Free-standing Cu nanowire (NW) arrays with...