Cu
CU5133
Kupfer Stange
- Durchmesser:
- 6.35 mm
- Reinheit:
- 99.99+%
- Beschreibung:
- Temper hard drawn OFHC C110.
Technische Daten:
Typical analysis ppm: P 1, S 10, Zn 1, Cd 1, O 3, Hg 1, Bi 1, Pb 2, Se 3, Te 3, Sn 3, Mn 1, Sb 10, As 10, Si 1, Ni 3, Al 1, Ag... Typical analysis ppm: P 1, S 10, Zn 1, Cd 1, O 3, Hg 1, Bi 1, Pb 2, Se 3, Te 3, Sn 3, Mn 1, Sb 10, As 10, Si 1, Ni 3, Al 1, Ag 20, Fe 2, balance Cu 99.99% minimum.
Citations
New Electrochemical Approach for Synthesis of Nanoporous Silver
Cu-Ag alloy films were electrodeposited on Au substrates to serve as precursor alloys for synthesizing finely-structured nanoporous Ag (NPS) structures. Two innovative approaches, surface limited redox replacement (SLRR) and defect mediated growth (DMG) along with overpotential deposition (OPD),...